Published configuration: confirm against controlled documents
The AS-RK3568-RTL-CUS carrier board is a 6-layer PCB in a 3.5-inch SBC form factor, industrial-grade components throughout, with conformal coating optional. The specifications below are the OEM/ODM default; every line is re-specable on request.
| Block | Specification |
|---|---|
| SoC | Rockchip RK3568 quad-core Cortex-A55 up to 2.0GHz, 22nm; or Allwinner A133 quad-core Cortex-A53 1.6GHz |
| NPU | RK3568 1 TOPS INT8 (AI tier); A133 no NPU (value tier) |
| GPU | RK3568 Mali-G52 2EE; A133 PowerVR GE8300 |
| Memory | LPDDR4 2GB / 4GB / 8GB (RK3568); LPDDR4 1GB / 2GB (A133) |
| Storage | eMMC 16GB / 32GB / 64GB; TF card expansion; M.2 NVMe on the RK3568 carrier |
| Display | Dual display: LVDS / eDP / MIPI DSI / HDMI; 1920x1080 or 3840x2160; independent or mirrored; portrait or landscape per output |
| Touch | Capacitive 10-point / 20-point; dual touch controllers on request |
| Payment and peripherals | QR / NFC / face payment, barcode imager, thermal printer, cash drawer, weighing scale, RFID, fingerprint, ID card reader |
| Camera | MIPI CSI 2-lane / 4-lane, ISP, 30 fps liveness capture |
| I/O | 4x USB 2.0, 2x USB 3.0, RS232 / RS485, up to 6 isolated COM, GPIO, relay, PWM, I2C, SPI |
| Network | 10/100M or dual Gigabit Ethernet, WiFi 5 / WiFi 6, Bluetooth 5.0, 4G LTE / 5G module, SIM slot |
| OS | Android 11 / 12 / 13 / 14 / 15; Linux; Ubuntu; Debian; AOSP; GMS or GMS-free; kiosk mode |
| Power | 12V DC standard; wide-voltage 9-36V on request; 24V vehicle input on request |
| Thermal and reliability | Fanless 6-layer carrier; 0C to 50C standard, -20C to 70C wide temp; 24/7 duty; hardware watchdog; RTC backup; ESD and EMC design |
| Form factor | 3.5-inch SBC, Pico-ITX, Mini-ITX, or core board plus custom carrier |
Application matrix: 8 customization scenarios for the AS-RK3568-RTL-CUS
The AS-RK3568-RTL-CUS is one carrier platform across eight different self-service checkout deployments. The matrix below shows the most common OEM/ODM customization angles an R&D hardware lead in Europe walks through in the first scoping call.
| Scenario | Catalog board limit | AS-RK3568-RTL-CUS customization |
|---|---|---|
| Self-service checkout kiosk | One display path, GMS-baked AOSP | Dual display, kiosk-mode GMS-free AOSP |
| POS terminal and cashier register | 2 COM ports, shared USB rail | 6 isolated COM, budgeted peripheral rail |
| Dual-screen cashier terminal | Mirrored output only, 90 ms lag | Two framebuffers, sub-16 ms sync |
| Restaurant and QSR ordering | Single printer port, cloud-only queue | Role-switchable printer, offline-first queue |
| Unmanned store and vending | 8 GPIO, online-only transactions | 64-channel GPIO, signed local ledger |
| Interactive self-service terminal kiosk | One accessory at a time | Concurrent printer, reader and display |
| Multi-platform A133 / RK3568 family | Two carriers, two contracts | One enclosure, one BSP train, one MOQ |
OEM/ODM workflow: 8 steps from kickoff to first article
Below is the actual OEM/ODM workflow an R&D hardware lead in Frankfurt walks through when commissioning a custom self-service checkout Android motherboard from AndroidSBC. No step is a placeholder.
- Day 0-3 — Requirements intake. A 90-minute call captures the lane layout, the I/O map, the payment stack, the OS choice, the certification scope and the volume profile. Output: a one-page requirements sheet.
- Day 4-7 — Feasibility study. AndroidSBC engineers validate the SoC choice (RK3568 or A133), the carrier I/O map, the BSP availability, the certification gap and the thermal envelope. Output: a feasibility report with go / no-go on each customization.
- Day 8-12 — Schematic and PCB layout. The AS-RK3568-RTL-CUS carrier board is laid out on a 6-layer stack-up with the customer's I/O map. Output: schematic and PCB review package.
- Day 13-18 — BSP porting. Android, Linux, Ubuntu or Debian BSP is ported to the customer's OS choice, with PREEMPT_RT patches and kiosk-mode locking where needed. Output: a BSP build for the customer's evaluation team.
- Day 19-23 — Sample fabrication. Five to ten engineering samples are fabricated at the Shenzhen source factory, with conformal coating and stencil rework as required. Output: samples shipped to the customer by air.
- Day 24-28 — Customer evaluation. The customer's evaluation team runs thermal, EMC, payment-peripheral and field-replication tests. Output: an evaluation report with sign-off or change requests.
- Day 29-31 — Design freeze and mass-production tooling. Any change requests are absorbed, the design is frozen, and mass-production tooling is opened at the source factory. Output: a frozen Gerber and a frozen BOM.
Thirty-two days from kickoff to first article. Ninety days from kickoff to mass production. This is the OEM/ODM rhythm that the R&D hardware lead in Europe learns to expect from a Shenzhen source factory that does this work for a living.
Frequently asked questions
What is the MOQ for a custom self-service checkout Android motherboard?
Answer: 100 units for OEM (a re-spin of an existing carrier board), 500 units for ODM (a from-scratch PCB layout). Sample orders of five units are accepted with an engineering report.
How long does OEM/ODM customization take from kickoff to first article?
Answer: 32 days on the workflow described above, including schematic, PCB layout, BSP porting, sample fabrication and customer evaluation. Mass production starts around day 90.
Should I choose RK3568 or Allwinner A133?
Answer: RK3568 for AI-assisted lanes, face payment, 4K output and multi-camera input; A133 for cost-driven entry tiers where a quad Cortex-A53 and 1080p dual display are sufficient. AndroidSBC builds both on the same enclosure cut-out so you can tier your own product line.
Do you support dual-screen independent display?
Answer: Yes. Two independent framebuffers with per-screen resolution and orientation, independent LVDS and eDP clock domains, sub-16 ms frame sync, and optional dual touch controllers.
Can you integrate the payment stack?
Answer: Yes — QR code, NFC, face-payment camera, barcode imager, fingerprint and ID card reader, plus EMVCo L2 and PCI PTS pre-scoping for card readers. Certification is done with your payment partner's module where required.
What OS and GMS options are available?
Answer: Android 11 / 12 / 13 / 14 / 15 AOSP, GMS or GMS-free, kiosk mode with a locked launcher, Ubuntu 22.04 LTS, Debian 12 and Linux with PREEMPT_RT. Custom ROM and pre-installed app builds are available.
What certifications can you pre-scope?
Answer: CE / FCC / RoHS standard. UL / UKCA / KC / PSE / SAA, GMS / Google EDLA, EMVCo L2 and PCI PTS are all pre-scoped on request. EMC pre-scanning is done in-house before third-party testing.
Do you support OEM/ODM and private label?
Answer: Yes. Custom logo, custom firmware, custom boot animation, custom UI, private-label PCBA and custom SDK modules are all standard OEM/ODM deliverables.
Do you accept sample and small-batch orders?
Answer: Yes. Samples ship in 1-3 days from stock where available; custom samples ship inside the 19-23 day window. Small-batch and large-volume pricing is available on request.
